By integrating DMOS architectures designed with a set of innovative techniques and taking advantage of state-of-the-art wafer-processing fabs, ST’s BCD offers best-in-class performance and the most advanced process nodes. With its expertise in both “More-Moore” and “More-than-Moore” semiconductor technologies, ST has an unmatched capability to offer the best BCD solutions. High-density BCD is driven by the need to integrate more and more complex and diversified functions on the same chip and to guarantee high quality and reliability in all types of application environments.
The integration of BCD on SOI (Silicon on Insulator) substrates addresses specific high-value applications in electromedical, automotive safety or audio. High-voltage BCD, which enables reliable coexistence on the same chip of low-voltage control circuits and very high-voltage DMOS stages with typical voltage capability up to 800V.The offer is divided into two types of BCD process: With know-how in process development and chip production honed over more than two decades, ST offers a unique range of BCD process technologies, each addressing specific application needs, with an optimal trade-off between functionality, performance and cost.